PAI Resin

PAI Resin Characteristics & Uses

To avoid improper resin selection, Contact PMC for additional help in determining the exact engineering resin required for your application.

Please Note: PMC does not sell the material listed below.  We only use the material list to inform visitors that we are experienced in processing these materials for many fine products.

MaterialPAI
Chemical NamePAI; Polyamide-imide; PI; Polyimide
StructureAmorphous
OpacityOpaque
StrengthVery Strong
Specific Gravity1.42
Shrinkage0.6%-0.9%
Melting Point820°F
Deflection Temperature532°F
Service Temperature500°F
ApplicationsPAI resin is used extensively in wire coatings.
Advantages

  • Possesses a Greater Heat Resistance than any other Unfilled Organic Material

  • Exceptional Mechanical, Thermal, Heat, Chemical & Fire Properties

Disadvantages

  • Difficult to Process – High Temperatures Required

  • Limited Resistance to Hydrolysis

  • High Cost