PAI Resin

PAI Resin Properties & Uses

To avoid improper resin selection, Contact PMC for additional help in determining the exact engineering resin required for your application.
Material PAI
Chemical Name PAI; Polyamide-imide; PI; Polyimide
 Structure Amorphous
Opacity Opaque
Strength Very Strong
Specific Gravity 1.42
Shrinkage 0.6% – 0.9%
Melting Point 820° F
 Deflection Temperature 532°F
Service Temperature 500°F

Applications

PAI resin is used extensively in wire coatings.

Advantages
  • Possesses a Greater Heat Resistance than any other Unfilled Organic Material
  • Exceptional Mechanical, Thermal, Heat, Chemical & Fire Properties
Disadvantages
  • Difficult to Process – High Temperatures Required
  • Limited Resistance to Hydrolysis
  • High Cost

For the most up-to-date information on engineering-grade resins, please visit: https://plastics.ulprospector.com/.

To avoid improper resin selection, Contact PMC for additional help in determining the exact engineering resin required for your application.